BOSTON, June 5, 2024 /PRNewswire/ -- Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the ...
Sintering process simulation software corrects for shrinkage and distortion of binder jet 3D printed parts during sintering, minimizing trial and error Live Sinter ...
With the trend from Si IGBT to SiC MOSFET in electric vehicle (EV) power electronics, the junction temperature is expected to increase from 150°C to 175°C with the potential to exceed 200°C. This ...
Powerful multi-physics sintering simulation software is now trusted by users at more than a hundred Desktop Metal binder jet 3D printer companies globally Simulation software predicts and corrects for ...
According to the Metal Powder Industries Federation (MPIF) Standard 35, sinter hardening is quench hardening during the cooling cycle of the sintering furnace. Accelerated cooling is applied to the ...
A centuries-old materials bonding process is being tested aboard the International Space Station in an experiment that could pave the way for more materials research of its kind aboard the orbiting ...
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